Posts Tagged ‘training’
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August 12th, 2009
Wire bonding training
Wire bonding, using predominantly gold bonding wire, remains the primary interconnection process in the semiconductor arena. With state-of-the-art bonders operating at rates > 32 bonds per second, it is a highly advanced manufacturing process. Learn more about the single-most important industrial application of gold through this event run by the International Microelectronics and Packaging Society.
Richard Holliday
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