Posts Tagged ‘IMAPS’
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April 9th, 2010
IMAPS – SEMI Wire bonding workshop
IMAPS and SEMI are running a Wire Bonding Workshop at SEMICON West. The objective of the Wire Bonding Workshop is to have a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who have been working in the area of wire bonding. If you are interested in presenting at the event please see the event website here. -
November 5th, 2009
Which gold conductor?
Yesterday afternoon at IMAPS 2009, we heard from Samson Shahbazi of Heraeus Materials Technologies on the subject of ‘Cost Effective Use of Gold in Thick Film Conductors’. Samson explained that designers of hybrid circuits had a choice between three basic classes of gold conductor; gold powder, flake and resinates. He went on to explain the relatives benefits of each. What was really interesting was that in response to a question from the audience along the lines of ‘what cheaper alternative materials and technologies are becoming available to replace gold in this application?’, the response was ‘there is nothing that offers anything like comparable performance to gold’. This looks like one application for gold that isn’t going to disappear in the short-term…..
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November 4th, 2009
The High Reliability Choice in Semiconductor Packaging
The reliability of gold in microelectronic packaging makes it the standard, by which all other materials must be judged. Even though the price of gold has risen significantly in this decade the usage of gold in microelectronic packaging has continued to grow as efforts to make the most cost-effective usage of gold through spot plating, plating thickness reduction and the usage of thinner bonding wire have been successful. Gold wire remains the main wire material for ball bonding in microelectronics assembly and has proven reliable in billions of devices over many years. However, high gold prices are increasingly forcing a shift towards cheaper copper wire, despite concerns over reliability. Today, in a paper with Lee Levine of Process Solutions Consulting at IMAPS 2009 we will be explaining that there is a need to obtain higher quality reliability data with gold and copper wires supported by state of the art analytical methods. This will help quantify and validate the relative merits of the two metals in this critical application. We also point out that design-for-recycling should also be an important consideration in material selection. The precious metals (mainly gold) constitute a very substantial proportion of the material value of waste electronic and electrical equipment (WEEE) and gold can be considered as a key component of the economic viability of WEEE recycling.
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August 27th, 2009
Gold: The High Reliability Choice in Semiconductor Packaging
At the IMAPS 2009 event, there is a special invited session on Intelligent Uses of Precious Metals in Microelectronics. With Lee Levine from Process Solutions Consulting, I’ll be presenting the case for why gold remains the high reliability choice in semiconductor packaging, a summary of which appears here.
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August 12th, 2009
Wire bonding training
Wire bonding, using predominantly gold bonding wire, remains the primary interconnection process in the semiconductor arena. With state-of-the-art bonders operating at rates > 32 bonds per second, it is a highly advanced manufacturing process. Learn more about the single-most important industrial application of gold through this event run by the International Microelectronics and Packaging Society.
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April 2nd, 2009
Update- IMAPS event
IMAPS workshop on ‘Intelligent Uses of Precious Metals in Microelectronics’ will now be incorporated into the IMAPS 2009 Symposium in San Jose, California – USA. The objective is to have a forum that brings together scientists, engineers, manufacturers, academia, and business people from around the world who have been working in the area of microelectronic packages and use precious metals in their applications.Those wishing to present a paper can still submit a 200-300 word abstract using the on-line submittal form
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March 6th, 2009
Workshop – Intelligent Uses of Gold in Microelectronics
IMAPS are planning a workshop ‘Intelligent Uses of Precious Metals in Microelectronics’ This event will run November 5 – 6, 2009, immediately following the IMAPS 2009 Symposium in San Jose, California – USA.
The objective of the workshop is to have a forum that brings together scientists, engineers, manufacturers, academia, and business people from around the world who have been working in the area of microelectronic packages and use precious metals in their applications. This workshop has been specifically organised to allow for the presentation and discussion of some of the best ways to use gold.
Those wishing to present a paper at the workshop must submit a 200-300 word abstract electronically no later than March 20, 2009, using the on-line submittal form
Richard Holliday
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