Posts Tagged ‘Harman’
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February 3rd, 2010
Copper wire bonding – do the cost savings add up?
I’ve just received a copy of the new edition of George G. Harman’s book (or ‘bible’) Wire Bonding in Microelectronics. George is widely considered to be the world’s foremost authority on wire bonding. I’d like to quote a passage from the book which is relevant to the ‘gold versus copper’ bonding wire debate (which I blogged on last week).” There is no question copper is a cheaper material but also one that brings new challenges to the bonding engineer. It may be a cost effective process in the eyes of a product manager but when the extra care and attention is required , it is weighed against the existing gold process and then we should ask ourselves, are the net savings worthwhile?”
Richard Holliday
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