Posts Tagged ‘copper bonding wire’
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January 29th, 2010
Concerns over shift from gold to copper bonding wire
There has been a lot of media coverage (see here and here for examples) of this week’s announcement of the results of a survey, conducted by SEMI, the global semiconductor industry association, which shows the semiconductor industry has serious reservations about the reliability and yield of copper bonding wire.
This global survey does show that an increasing number of companies are considering using copper for some new products – but the results of this survey show that there are still serious reservations in the industry over the use of copper wire in packaging technology. It is clear that gold has proven reliability and a track record – industry professionals still recognise this. We plan to undertake further research to discover the extent of the difference in reliability of gold versus copper over the coming months……
Richard Holliday
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