March 10th, 2010
SEMICON China
World Gold Council, is helping to train engineers and chip designers in the technology of wire bonding. At next week’s SEMICON China 2010 we are sponsoring a seminar entitled ‘Materials Science of Wire Bonding & Wire Bond Reliability’ in conjunction with SEMI. This will include best practice in wire bonding technology and materials selection issues. To register for this seminar please click here.
Richard Holliday
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