September 23rd, 2009

Lead-free packaging with gold inks?

29326This open access paper published in the Journal of Electronic Materials investigated gold nanoparticle inks as potential candidates for lead-free packaging applications. The main advantage of the inks are the very low melting points, good conductivity compared to eutectic solders and excellent thermal stability/electromigration resistance.

Richard Holliday Richard Holliday

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